LiquidStack GigaModular CDU: A Masterclass in Modular Design

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LiquidStack unveils the GigaModular Coolant Distribution Unit, an industry-first scalable modular CDU designed to scale and future-proof cooling capacity

A new high-density, direct-to-chip liquid cooling platform has been launched by LiquidStack, designed to offer extended cooling capacity via a modular design. 

The liquid cooling company has announced its new GigaModular CDU offering at Datacloud, stating that it is the industry’s first modular and scalable cooling distribution unit (CDU). It has up to 10 megawatts (MW) of cooling capacity, which is made possible through its modular platform and pay-as-you-grow installation approach. 

“AI will keep pushing thermal output to new extremes and data centres need cooling systems that can be easily deployed, managed and scaled to match heat rejection demands as they rise,” says Joe Capes, CEO of LiquidStack. 

Joe Capes, CEO, LiquidStack

Check out our exclusive interview with Joe Capes in this month’s edition of Data Centre Magazine, published today.

Scaling to support hyperscale data centres

GigaModular is the industry’s first scalable modular CDU built on a future-proof platform specifically to expand liquid cooling capacity. 

Customers can deploy it fast, scale it on demand and operate it easily on account of a centralised control, simplified service and a pay-as-you-grow model. Specifically built for AI, HPC and hyperscale data centres, the platform is designed for giga-scale infrastructure and is capable of scaling to support hundreds of megawatts across distributed deployments.

The company says: “it’s not just a CDU, it’s an architecture for the future.”

It has been built with the huge surge of AI and cloud computing adoption, as the global data centre liquid cooling market is anticipated to grow from US$5.17bn in 2025 to approximately US$15.75bn by 2030.

LiquidStack GigaModular CDU platform key facts:
  • Fully scalable cooling capacity: Scalable, modular platform supporting single-phase Direct-to-Chip liquid cooling heat loads from 2.5MW to 10MW
  • Pump module: High-efficiency IE5 pump and dual BPHx deliver scalable performance; dual 25um strainers protect critical components to ensure reliable operation at scale
  • Control module: Centralised design, separate pump and control modules reduce both the number of components and complexity
  • Instrumentation kits: Centralised pressure, temperature and EM flow sensors optimise control
  • Simplified service access: Serviceable from the front of the unit, with no rear or end access required, allowing the system to be placed against the wall
  • Optional configuration: Skid-mounted system with rail and overhead piping pre-installed or shipped as separate cabinets for on-site assembly

“With up to 10MW of cooling capacity at N, N+1, or N+2, the GigaModular is a platform like no other – we designed it to be the only CDU our customers will ever need. It future-proofs design selections for direct-to-chip liquid cooling without traditional limits or boundaries.”

Meeting AI halfway: Prioritising sustainable design

The demanding nature of AI is pushing data centre thermal management requirements to heights never before seen. As hardware continues to ramp up worldwide, with companies like Nvidia announcing new innovations, the need for future-proof cooling has never been more important. 

Image: LiquidStack

These more sophisticated technologies typically generate heat at far greater densities than traditional processing units, which inevitably puts pressure on operators to consider their emissions.

Companies like LiquidStack are eager to beat that change and encourage greater sustainable progress.

LiquidStack is showcasing the new GigaModular CDU at Datacloud Global Congress, in Cannes, France, from June 3 – 5 at the Palais des Festivals. 

Attendees can visit LiquidStack at Booth #88 for an immersive, VR-driven demonstration.

Data Centre Magazine will also be on the ground at the event.


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