Foxconn and Intel Partner for Smart AI Infrastructure Growth

Foxconn and Intel are joining forces to develop next-generation AI infrastructure and intelligent computing platforms, with data centre technology sitting at the centre of the collaboration.

The agreement brings together the world's largest electronics manufacturer and one of the industry's leading chipmakers as demand for AI infrastructure continues to grow across hyperscale, enterprise and edge environments.

While the partnership spans smart manufacturing, robotics, smart cities and automotive applications, a major focus is the development of technologies designed to support AI data centres. The companies plan to collaborate on AI systems, rack-scale infrastructure and data centre technologies that support increasingly demanding workloads.

The announcement comes at a time when organisations are investing heavily in infrastructure capable of supporting AI training, inference and emerging agentic AI applications, placing new demands on compute, cooling and system design.

Focus on AI data centre infrastructure

The agreement covers several areas directly linked to modern data centre development.

Foxconn and Intel will explore the development and commercialisation of rack-scale AI infrastructure, including Intel Xeon-based CPU racks and AI accelerator architectures. The companies will also work on technologies that support AI data centre scalability.

Among the areas of collaboration are high-speed interconnect technologies, thermal management, liquid cooling designs and system telemetry. These technologies are becoming increasingly important as operators deploy higher-density computing environments and seek greater efficiency from AI infrastructure.

The partnership also extends to design services, including custom ASICs (application-specific integrated circuits), System on a Chip (SoC) technologies and broader system integration solutions.

Beyond traditional data centre environments, the companies plan to support physical AI applications such as robotics, edge intelligence and agentic AI systems. Many of these deployments rely on infrastructure that connects edge environments with centralised data centres and cloud platforms.

Intel's growing focus on AI infrastructure reflects wider investment across the sector. The company reported first-quarter 2026 revenue of US$13.6bn, an increase of 7% year on year, as demand for AI-related technologies continues to expand.

Supporting AI ecosystems

Foxconn says the partnership aligns with its wider technology strategy and its efforts to support AI adoption across multiple industries.

Young Liu, Chairman and CEO of Foxconn, says: “AI is rapidly transforming industries and society worldwide.

“Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV and smart city.

“Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration and global supply chain capabilities to jointly build next-generation AI infrastructure, Edge AI and Physical AI ecosystems, accelerating the adoption of AI applications worldwide.”

The collaboration builds on Foxconn's position within the wider AI ecosystem, where it already works closely with technology providers supporting large-scale infrastructure deployments.

Intel expands infrastructure partnerships

For Intel, the partnership forms part of a broader strategy focused on expanding its role across AI infrastructure, from silicon design through to complete systems.

Lip-Bu Tan, Intel’s CEO, says: “The rapid growth of AI, especially in inference and agentic workloads at scale, is redefining what modern computing must deliver.

“These demands require innovation across the full stack, from new silicon and chip design to rackscale systems and extending all the way to edge and physical AI deployments.

“Our collaboration with Foxconn brings together two innovation leaders with deep expertise in chip design, rack-scale solutions and global systems integration.

“Together, we are accelerating the delivery of end-to-end platforms that unlock new capabilities and extend the impact of AI worldwide.”

Alongside the Foxconn announcement, Intel also revealed expanded partnerships with Siemens and Hitachi. Its collaboration with Siemens includes exploring purpose-built Intel silicon for applications that may include edge devices, high-performance computing and robotics.

The Foxconn agreement places particular emphasis on the infrastructure layer underpinning AI deployment. By combining expertise in chip design, manufacturing, systems integration and data centre technologies, the two companies are targeting the platforms required to support growing AI workloads across both centralised data centres and distributed computing environments.