How MiTAC Delivers Scalable Rack-to-Cluster AI Solutions

Leveraging over 30 years of expertise, MiTAC Computing Technology Corp. delivers End-to-End solutions spanning high-performance servers to fully customised rack integration services. Its innovative, scalable systems equip global data centres with the agility and efficiency necessary to thrive in this demanding era.

Ultimate Performance: MiTAC MR1100 Series Liquid-Cooled AI Cluster Powered by AMD Instinct™ MI355X GPUs

The MR1100 Series is purpose-built to meet the rigorous demands of contemporary AI and high-performance computing (HPC).

This flagship platform, the G4826Z5 compute node, is powered by AMD EPYC™ 9005 Series processors and leverages up to eight AMD Instinct™ MI355X GPUs within a 4U2S server chassis.

Utilising advanced direct liquid cooling (DLC) technology for both CPUs and GPUs, the design achieves unmatched thermal performance – even under the relentless workloads associated with AI model training and HPC simulations. DLC ensures heat is efficiently removed at the source, enabling stable high-frequency operation and maximised performance throughout extended computation.

Scalability is a cornerstone of the MiTAC AI cluster architecture. Organisations can deploy clusters that scale from 64 GPUs for initial research environments up to 256 and more GPUs for full-scale production, supporting diverse industry needs as workloads evolve. 

High-performance network fabrics – offering 400Gb/s and 800Gb/s throughput – are integrated to maintain ultra-fast data transfers, reduce bottlenecks and enhance distributed AI training efficiency. 

Each compute node combines dual AMD EPYC™ CPUs with up to 6TB DDR5-6400 memory, creating a foundation for unprecedented compute density and reliability. The result is a turnkey solution fine-tuned for the most compute-intensive, mission-critical workloads found in AI research, analytics and scientific computing.

Diverse rack integration service: Flexible deployment foundations

MiTAC delivers a comprehensive array of rack-scale solutions designed to empower next-generation data centre deployments.

These offerings range from advanced liquid-cooled racks engineered specifically for AI clusters and high-density computing, to traditional air-cooled racks that fit established environments or hybrid deployments. 

MiTAC is adept at supporting both industry-standard EIA rack formats as well as Open Rack v3 (ORv3) architecture, enabling clients to customise their infrastructure around their technical preferences and physical space constraints.

Every MiTAC rack solution is built with exceptional scalability and flexibility in mind – paving the way for both incremental expansion and large-scale installations. 

The systems are customisable to specific workload demands, whether those focus on AI, HPC or other data centre applications. This breadth of rack offerings ensures that MiTAC customers can precisely align their infrastructure with rapidly evolving technologies and unique business objectives while maintaining a level of operational consistency and reliability.

Integration and manufacturing capability: Accelerating time-to-deployment

One of MiTAC’s strongest differentiators lies in its end-to-end rack integration, system design, manufacturing and deployment solutions, which are engineered to streamline every phase of the data centre build-out process. 

MiTAC’s integration specialists oversee all critical phases, from power and cooling planning through to exhaustive networking and cabling layouts, ensuring that every component is meticulously assembled and optimised for efficiency and reliability.

MiTAC conducts full system integration, OS readiness checks and rigorous burn-in testing during pre-delivery validation, so that all deployed rack clusters exhibit exceptional operational reliability from day one. 

With large-scale global manufacturing centres, MiTAC anticipates achieving over 13MW rack-scale manufacturing capacity by 2025, with output rates reaching 3,000 racks per month. 

Vertical integration capabilities mean that everything from PCB and motherboard design to complete system and cluster fabrication is handled in-house. This robust manufacturing and integration structure enables MiTAC to offer dynamic, tailor-made solutions in the US, EMEA, China and SEA – significantly accelerating time-to-deployment and allowing customers to rapidly respond to new business opportunities.

Learn more

For cutting-edge, scalable computing deployments, MiTAC’s end-to-end integration solutions set the industry benchmark for agility, reliability, and customisation. Discover more or connect with MiTAC’s team at their booth during the SC show to experience next-gen rack-to-cluster innovation firsthand.