STMicroelectronics: Innovating AI Data Centre Optics

With each new AI innovation, data centre operators need access to the latest cutting-edge technology for advanced networking infrastructure. 

In response, STMicroelectronics is working on new tech that is designed for faster data transfer inside AI data centre networks.

The company is producing a silicon photonics-based PIC100 platform at scale, which is a type of technology designed to support optical interconnects inside hyperscale data centres and AI computing clusters.

Using optical technology at high volume is essential in modern data centres as it allows faster data transfer and higher bandwidth than traditional electrical connections.

How silicon photonics technology works

It works by converting electrical signals into light pulses, which travel through a fibre cable to another device, where it is converted back into an electrical signal.

This is especially important for AI workloads as without high-capacity optical networking, AI clusters would struggle to move data quickly enough to keep the processors fully operational.

The platform enables 800G and 1.6T optical transceivers used in very high-speed data transmission between servers and storage systems. These optical links help reduce latency while supporting the large bandwidth requirements created by GPU-based computing clusters.

STMicroelectronics is now manufacturing the PIC100 platform on its 300 mm semiconductor production lines, enabling large-scale production to supply hyperscale cloud providers building AI infrastructure.

Fabio Gualandris, President of Quality, Manufacturing & Technology at STMicroelectronics, says: “Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers.

“The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle.

“Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.”

Optical connectivity inside AI data centres

Optical networking technology plays a significant role in modern data centre architecture. Large AI clusters rely on thousands of GPUs working together to train and run AI models. These systems generate enormous volumes of data traffic between servers.

Optical transceivers support this communication by transmitting signals through fibre cables rather than traditional electrical wiring.

The PIC100 platform is designed to support high-performance optical communication through silicon photonics, which use silicon semiconductor manufacturing techniques to build optical components such as waveguides on a single chip.

Waveguides are microscopic structures that guide light through the photonic circuit, and low optical loss in these components allows the signals to travel further within the chip without degrading.

STMicroelectronics states that the PIC100 platform delivers low waveguide loss for both silicon and silicon nitride materials. 

Demand for pluggable optics grows

The demand for optic technology continues to grow as data centres and AI infrastructure hyperscale, and pluggable optics are tools which allow operators to upgrade network speeds by replacing transceivers rather than entire systems.

Dr. Vladimir Kozlov, CEO and Chief Analyst at LightCounting LLC, says: “The data centre pluggable optics market continues to expand strongly, reaching $15.5bn in 2025.

“We expect the market to grow at a compound annual growth rate (CAGR) of 17% from 2025 through 2030, surpassing $34 billion by the end of the forecast period.

“In addition, co-packaged optics (CPO) will emerge as a rapidly growing segment, contributing more than $9 billion in revenue by 2030.

“Over the same period, the share of transceivers incorporating silicon photonics modulators is projected to increase from 43% in 2025 to 76% by 2030.

“ST’s leading silicon photonics platform coupled with its aggressive capacity expansion plan illustrates its capabilities to provide hyperscalers with secure, long-term supply, predictable quality and manufacturing resilience.”

The maintenance of networking components is now essential as infrastructure deployments accelerate for data centre hyperscalers and large AI clusters require thousands of optical links to connect storage and switching platforms.

Next-generation photonics platform

STMicroelectronics is also developing the next stage of its silicon photonics roadmap with a new technology platform known as PIC100 TSV.

This platform integrates through-silicon via (TSV) technology. TSV technology enables tighter integration between electronic and photonic components by allowing signals to move vertically through the chip.

By integrating TSV structures, the PIC100 TSV platform aims to increase optical connectivity density while improving module integration and thermal efficiency.

The platform is designed to support emerging optical architectures such as Near Packaged Optics and co-packaged optics. These designs place optical interconnect components closer to network switches and processors, reducing electrical signal distance and improving data transfer efficiency.

The PIC100 platform and its planned successor technology form part of STMicroelectronics’ strategy to support optical networking infrastructure used by hyperscale operators building high-performance data centre environments.