LG and Flex: Cooling the Growing Heat of AI Power

LG Electronics and Flex, one of the global manufacturing leaders and innovators within data centre infrastructure solutions, have signed a Memorandum of Understanding (MoU). 

The agreement will see the two companies partner on the joint development of integrated, modular cooling solutions, addressing the thermal management challenges of AI era data centres.

High-density data centres require advanced cooling technologies in order to create more coherent heat dissipation.

LG and Flex: Keeping it cool, literally

The collaboration between the two companies will bring together LG’s high-performance air and liquid cooling modules which includes CRAC, CRAH, chillers, coolants distribution units 9CDUs) and multiple thermal management and monitoring solutions utilised from Flex’s IT Infrastructure, liquid cooling portfolio and proprietary power product. Data centre operators are therefore able to customise solutions and scale with demand.   

Michael Hartung, President and Chief Commercial Officer of Flex, said: “Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data centre.

“Together, we’ll deliver prefabricated, scalable data centre infrastructure solutions that incorporate advanced liquid and air cooling technologies to increase efficiency, simplify deployment and speed time to revenue for our customers.”

Taking data centres worldwide

LG is exploring diverse data centre opportunities worldwide and recently secured an AI data centre project in Jakarta, lining it up to be one of the largest data centres of its kind in Indonesia. 

In early September 2025, LG announced a collaboration with DATAVOLT on projects in the Middle East and Africa.

Rajit Nanda, CEO of DataVolt, said: “We are building a new generation of net-zero, AI-ready data centres designed for performance, scale and sustainability.

“Partnering with LG allows us to integrate world-class cooling technologies that are critical to enabling the digital transformation of governments and enterprises across the Kingdom of Saudi and beyond.”

LG is also developing next-generation CDUs and cold plate solutions scheduled for completion towards the end of 2025. It  follows LG’s partnership with LG Uplus to develop and complete a proof-of-concept that demonstrates advanced liquid cooling technology for data centre thermal management solutions

James Lee, President of the LG ES Company said: “One LG Solution is ready to reshape the global data centre landscape with future-ready solutions from LG Electronics, LG CNS and LG Energy Solution.

“With our leading thermal management systems, intelligent operation capabilities and resilient power solutions, we can supply data centre operators with everything they need to scale efficiently in the AI era.”

LG and Flex turn up the heat on AI innovation

“We are advancing our competitiveness in the AI data centre market by strategically partnering with leading global companies," said James.

“Our collaboration with Flex adds new momentum to our global expansion and enhances our ability to deliver unique value to clients worldwide.”

The new co-developed solutions will form part of the Flex AI Infrastructure Platform, a breakthrough in global data centre design that brings together power, cooling, compute and services in a single modular system.

Built on Flex’s manufacturing capabilities, the platform introduces advanced energy and thermal innovations alongside comprehensive lifecycle management to help data centres overcome the growing demands of AI workloads.

Speaking on a previous collaboration with Nvidia, Michael said: "Flex is at the forefront of supporting data centre operators to overcome escalating power, heat and scale constraints of the AI era.”