How LG is Targetting AI Data Centre Cooling with HVAC Tech

LG Electronics has brought data centre cooling into focus at AHR Expo 2026 in Las Vegas, unveiling new HVAC (heating, ventilation and air conditioning) technologies designed for AI and high-density compute environments. 

Its industrial solutions include modular chillers, CDU systems and cold plates tailored to the specific needs of data centre operators.

James Lee, President of the LG ES Company, says: “The HVAC solutions we are presenting at AHR Expo 2026 reflect our commitment to delivering practical, energy-efficient solutions that meet changing market conditions and customer needs. 

“We continue to expand our HVAC portfolio across residential, commercial and industrial applications, while integrating AI into system operation and control to support efficiency, reliability and sustainability across diverse operating conditions.”

Cooling systems designed for density and scale

LG’s data centre approach centres on its modular inverter scroll heat pump chiller. Each unit offers high-capacity cooling with a low-noise profile, using a single power and piping connection to streamline installation. 

Up to six units can be connected and managed through a built-in touchscreen interface, which enables coordinated control and performance monitoring.

Alongside air-based cooling, LG is expanding its liquid cooling offering with the CDU and cold plate system. These technologies are purpose-built for high-density workloads like AI training and inference, which produce intense heat in small spaces. 

The CDU regulates coolant flow and temperature while offering practical servicing features such as slide-rail pump access and quick-release filters. The cold plate solution focuses on thermal performance, using an optimised heat exchange structure to support high thermal design power (TDP) processors. 

This set-up provides a targeted cooling option for rack-mounted hardware where airflow is insufficient.

Also being showcased is LG’s oil-free inverter centrifugal chiller, which serves facilities with centralised plant cooling strategies. 

Such chiller technology brings stable operation and precise temperature control, helping data centre operators maintain optimal environmental conditions.

Integration with building-wide HVAC platforms

For data centres with mixed cooling environments or multi-use facilities, LG has unveiled its ACP i building control platform. 

ACP i provides centralised monitoring, early fault detection and data-driven energy management. It helps operators monitor cooling systems alongside building power and HVAC infrastructure, providing a single point of control.

LG’s broader HVAC architecture, including its AI-powered Multi V™ i variable refrigerant flow system, supports flexible integration in sites where edge data centres or office floors share infrastructure with backend compute. 

These systems are designed for installation flexibility and adaptive control, complementing direct liquid cooling with ambient temperature management where needed.

Core technologies and component-level innovation

At the LG Component Solution booth in Vegas, the company has been highlighting core parts used in its data centre cooling systems. These include advanced scroll compressors and electronically commutated (EC) motors and fans, designed to improve reliability, efficiency and long-term performance.

The next-generation component technologies draw on nearly 70 years of LG’s motor and compressor design expertise. These include DualJet™ in the BHA Series for reciprocating compressors, TriVane™ rotary compressor design and CurvedSpoke™ technology for BLDC motors. All aim to support system stability under the demanding conditions found in AI data centres.

LG’s appearance at AHR Expo 2026 reflects rising global demand for efficient and scalable data centre cooling. With AI workloads growing in both scale and density, operators are seeking infrastructure that can support higher heat loads without compromising reliability or sustainability. 

LG’s offering addresses this challenge through modular systems, liquid cooling and smart control platforms that respond to real-world usage in real time.