Siemens and nVent Unveil Nvidia AI Data Centre Blueprint

Siemens and nVent have announced a joint reference architecture designed to help operators accelerate the buildout of hyperscale AI data centres. 

The companies have combined their expertise in electrical systems and liquid cooling to create a Tier III-capable blueprint specifically engineered for high-density Nvidia AI infrastructure, including Nvidia DGX SuperPOD with DGX GB200 systems.

Sara Zawoyski, President of nVent Systems Protection, says the collaboration reflects the company’s long-standing focus on advanced cooling. 

“We have decades of expertise supporting customers’ next-generation computing infrastructure needs,” Sara says. 

“This collaboration with Siemens underscores that commitment. The joint reference architecture will help data centre managers deploy our cutting-edge cooling infrastructure to support the AI buildout.”

Designing for 100MW hyperscale AI campuses

The reference architecture has been built for data centres scaling to around 100MW, with liquid-cooled racks and dense compute clusters shaped around Nvidia’s AI designs. 

By aligning with Nvidia DGX SuperPOD reference models, Siemens and nVent aim to reduce integration complexity and help operators deploy large-scale AI environments at speed.

The design combines Siemens’ industrial-grade power distribution, automation and energy management systems with nVent’s liquid cooling portfolio. 

The companies say this pairing offers a cohesive technical framework for high-density workloads, addressing rising power consumption, cooling requirements and operational risk across hyperscale facilities.

Ciaran Flanagan, Global Head of Data Center Solutions at Siemens, explains how the architecture is intended to support scale and energy efficiency. 

“This reference architecture accelerates time-to-compute and maximizes tokens-per-watt, which is the measure of AI output per unit of energy,” hey says.

“It’s a blueprint for scale: modular, fault-tolerant, and energy-efficient. Together with nVent and our broader ecosystem of partners, we’re connecting the dots across the value chain to drive innovation, interoperability and sustainability, helping operators build future-ready data centres that unlock AI’s full potential.”

Responding to rising density and greater complexity

Growing AI adoption continues to push rack densities upwards, increasing the operational significance of cooling efficiency and electrical resilience. 

Power availability, heat rejection and modular expansion are emerging as the dominant challenges for operators building AI-class compute environments.

Reference architectures like the Siemens–nVent model give operators a standardised pathway for deployment. 

By integrating electrical systems, cooling technologies and Nvidia reference designs, the architecture aims to remove fragmented engineering processes and shorten project timelines. 

It also provides a unified framework for vendors and hyperscalers to develop compatible solutions.

Siemens’ intelligent electrical and automation foundation

Growing AI adoption continues to push rack densities upwards, increasing the operational significance of cooling efficiency and electrical resilience. 

Power availability, heat rejection and modular expansion are emerging as the dominant challenges for operators building AI-class compute environments.

Reference architectures like the Siemens–nVent model give operators a standardised pathway for deployment. 

By integrating electrical systems, cooling technologies and Nvidia reference designs, the architecture aims to remove fragmented engineering processes and shorten project timelines. 

It also provides a unified framework for vendors and hyperscalers to develop compatible solutions.

Siemens’ intelligent electrical and automation foundation

Siemens brings a broad suite of technologies to the collaboration, spanning medium and low voltage power distribution, scalable automation, energy management software and digital services. 

Its portfolio includes IoT-enabled hardware, AI-driven applications and cloud-connected tools designed to support operational transparency and improve energy performance.

For AI data centres in particular, Siemens’ electrical systems provide the foundation for stable high-density deployments. 

Voltage regulation, monitoring and grid-interactive features help maintain uptime as operators increase the proportion of liquid-cooled racks and GPU-based clusters. 

The integration within the reference architecture is aimed at ensuring consistency from design to operation across hyperscale footprints.

nVent’s liquid cooling capabilities

nVent contributes liquid cooling technologies built for high-density compute environments and shaped through partnerships with chip manufacturers, OEMs and hyperscalers. 

Its solutions are designed to manage thermals at scale, maintain efficiency and support future compute generations without major infrastructure redesign.

The company’s engineering teams have delivered cooling environments for global cloud providers and large operators and the new blueprint embeds those learnings into a deployment-ready model. 

The reference architecture outlines approaches for direct liquid cooling integration, coolant distribution and thermal management across modular data hall layouts.

Siemens and nVent say the joint architecture will support operators building the next wave of AI-ready data centres, where performance, sustainability and deployment speed are tightly linked to electrical design and advanced cooling.