Vertiv: Cooling High-Density Data Centres with ā€˜MegaMod HDX’

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Viktor Petik, Senior Vice President of infrastructure solutions at Vertiv
Vertiv unveils MegaMod HDX, a modular liquid cooling system for AI and HPC data centres supporting rack densities over 100 kW

Vertiv has announced the launch of a new modular liquid cooling and power infrastructure designed for high-density data centre environments. 

The Vertivā„¢ MegaModā„¢ HDX is a prefabricated solution aimed at supporting AI and HPC workloads across North America and EMEA.

Available in multiple configurations, the MegaMod HDX combines direct-to-chip liquid cooling with air cooling to support power capacities up to 10MW and rack densities from 50kW to more than 100kW per rack.

Built for scale, the Vertivā„¢ MegaModā„¢ HDX supports AI and HPC workloads throughout North America and EMEA (Credit: Vertiv)

Supporting dense AI compute demands

Vertiv offers the MegaMod HDX in two options. 

The compact module has a standard height and supports up to 13 racks with a power capacity of 1.25MW. The larger combo version features an extended-height design supporting up to 144 racks and a maximum of 10MW capacity. Both versions are prefabricated and scalable.

The hybrid cooling architecture integrates direct-to-chip liquid cooling with traditional air cooling. 

An approach like this targets the high thermal loads of pod-style AI environments and advanced GPU clusters while enabling more efficient power and thermal management.

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Viktor Petik, Senior Vice President of infrastructure solutions at Vertiv, says: ā€œToday’s AI workloads demand cooling solutions that go beyond traditional approaches. 

ā€œWith the Vertiv MegaMod HDX available in both compact and combo solution configurations, organisations can match their facility requirements while supporting high-density, liquid-cooled environments at scale. 

ā€œOur designs deliver what data centres need most—reliable performance, operational efficiency and the ability to scale their AI infrastructure with confidence.ā€

Both MegaMod HDX options come fully prefabricated with integrated cooling and power components, tested in factory conditions to streamline deployment.

Reliable architecture and continuous operation

Vertiv designs the MegaMod HDX to support continuous operation, even during maintenance or unexpected downtime. 

The system uses a distributed redundant power architecture, allowing it to remain online if one module fails.

A built-in buffer-tank thermal backup ensures that GPU clusters stay thermally stable during load transitions or servicing. This design allows operators to maintain performance without disruption in high-density environments.

The prefabricated structure and factory-tested systems also support faster rollout across sites, helping operators reduce the time and complexity of data centre builds.

Vertiv supports the full deployment lifecycle through its global service network, offering end-to-end assistance from installation to operation.

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Integration across Vertiv's infrastructure portfolio

MegaMod HDX integrates with Vertiv’s wider range of power, thermal and IT infrastructure solutions. 

The system includes key components such as the Vertivā„¢ LiebertĀ® APM2 uninterruptible power supply (UPS), the Vertivā„¢ CoolChip CDU cooling distribution unit and the Vertivā„¢ PowerBar busway system.

Monitoring is handled through the Vertivā„¢ Unify infrastructure management platform, which helps operators track system health and performance.

IT infrastructure is supported through Vertiv’s rack solutions, including Vertivā„¢ racks and Vertivā„¢ OCP-compliant racks. 

The MegaMod HDX also supports Vertivā„¢ CoolLoop RDHx rear door heat exchangers, Vertivā„¢ CoolChip in-rack CDUs, Vertivā„¢ rack power distribution units and Vertivā„¢ PowerDirect in-rack DC power systems. 

Cooling distribution is further supported by the Vertivā„¢ CoolChip Fluid Network Rack Manifolds.

By combining prefabricated cooling and power with integration across its existing portfolio, Vertiv positions MegaMod HDX as a scalable solution for AI and HPC data centres needing to manage rising density and deployment demands.

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