Inside Vertiv's CoolChip Launch for High-Density Workloads
AI workloads are quite literally pushing data centres into hotter territory.
Data centre operators across Europe, the Middle East and Africa are searching for cooling systems that keep pace with increasingly dense racks.
Vertiv is now widening its liquid cooling portfolio in EMEA with new products designed to support high-density AI infrastructure while reducing deployment complexity and pressure on white space.
The company has announced it is unveiling its CoolChip CDU 2300 and its CoolChip Fluid Network Row Manifolds at the Datacloud Global Congress in Cannes, which is taking place from 1-4 June.
Both products form part of Vertiv’s end-to-end thermal chain, which combines liquid cooling, heat rejection, controls and lifecycle services into a connected cooling architecture for modern data centres.
Cooling infrastructure adapts to AI growth
The growth of AI infrastructure has changed how facilities approach power density and thermal management.
Traditional air cooling struggles to manage the heat generated by accelerated computing and high-performance processors, leading operators towards liquid cooling systems that move heat more efficiently.
Paul Ryan, President for EMEA at Vertiv, says: “The rapid growth of AI workloads is driving a fundamental shift in how data centres are designed, cooled, powered and operated.
“At Datacloud Global Congress, we’re showing how Vertiv is expanding its end-to-end portfolio, combining high-density power solutions, liquid cooling, heat rejection, intelligent controls, and lifecycle services, to help customers deploy AI-ready infrastructure faster and operate more efficiently over time.”
The Vertiv CoolChip family sits at the heart of that strategy. The portfolio includes direct-to-chip cooling, where liquid removes heat directly from processors, as well as immersion cooling and rear-door heat exchangers that capture heat at rack level.
Vertiv has combined these systems with coolant distribution and monitoring technologies to create what it describes as a unified thermal chain.
The Vertiv CoolChip CDU 2300 is a liquid-to-liquid coolant distribution unit which delivers up to 2.3MW of cooling capacity.
The CDU 2300 was designed with space efficiency in mind as much as cooling performance.
The company says the system offers one of the highest capacity-to-footprint ratios currently available, allowing operators to deploy high-capacity cooling without sacrificing valuable floor space.
Compact cooling for dense deployments
The smaller cabinet design allows the CDU to sit in-row alongside IT equipment or within adjacent mechanical areas.
Reducing the number of cooling units inside a hall can simplify layouts and leave more room for revenue-generating compute infrastructure.
The CDU systems span capacities from 100kW to 2.3MW and support direct-to-chip cooling alongside rear-door heat exchangers.
Integrated controls inside the CDU automatically adjust coolant temperature and flow rates according to workload demand.
Within the design, Vertiv has also included redundancy features, unit-to-unit communication and remote monitoring capabilities aimed at maintaining uptime and easing operations management.
The controller-level intelligence allows the CDU to coordinate with other parts of the cooling environment to maintain stable thermal performance across the facility.
That interoperability is especially important for operators who blend different cooling technologies inside the same data centre.
AI deployments often combine traditional air-cooled racks with liquid-cooled accelerated computing infrastructure, creating more complex thermal environments.
The new Vertiv™ CoolChip Fluid Network Row Manifolds address part of that complexity by acting as the physical connection layer between cooling systems, servers and heat rejection infrastructure.
Building the thermal chain
Manifolds distribute coolant through the liquid cooling network and support integration between different cooling approaches.
Vertiv says each manifold assembly undergoes flushing, passivation, pressure testing and sealing processes designed to improve cleanliness, corrosion resistance and leak prevention.
The systems support direct-to-chip cooling, immersion cooling and rear-door heat exchanger deployments while simplifying coolant routing through the data hall.
The configurable design also supports retrofit projects as operators upgrade existing facilities for AI workloads.
Vertiv says the technology can help customers deploy liquid cooling infrastructure within weeks rather than months, a timescale which is critical as AI demand accelerates capacity planning across the sector.
Alongside the hardware portfolio, Vertiv packages design support, installation and maintenance through its Vertiv Liquid Cooling Services offering.
The company says this lifecycle approach helps operators maintain efficiency and availability as liquid cooling becomes a larger part of mainstream data centre operations.
